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ESD1014
PACKAGE DIMENSIONS
UDFN10 2.6x2.6, 0.5P
CASE 517AN
ISSUE B
D
A
B
NOTES:
1. DIMENSIONING AND TOLERANCING PER
ASME Y14.5M, 1994.
2. CONTROLLING DIMENSION: MILLIMETERS.
3. DIMENSION b APPLIES TO PLATED
TERMINAL AND IS MEASURED BETWEEN
0.15 AND 0.30mm FROM TERMINAL.
PIN ONE
REFERENCE
E
4. COPLANARITY APPLIES TO THE EXPOSED
PAD AS WELL AS THE TERMINALS.
MILLIMETERS
DIM
MIN MAX
A
0.45 0.55
2X
0.10 C
A1
A3
0.00 0.05
0.127 REF
2X
0.10 C
TOP VIEW
b
D
D2
0.20 0.30
2.60 BSC
2.00 2.25
0.10 C
A3
A
E
E2
e
K
2.60 BSC
1.11 1.36
0.50 BSC
0.20 ---
10X
0.08 C
NOTE 4
SIDE VIEW
A1
C
SEATING
PLANE
L 0.30 0.40
SOLDERING FOOTPRINT*
2.25
10X
L
1
D2
5
E2
10X
0.58
1.42 2.90
10X
K
10 6
e
BOTTOM VIEW
10X
b
0.10 C A B
0.05 C NOTE 3
10X
0.30
0.50
PITCH
DIMENSIONS: MILLIMETERS
*For additional information on our Pb ? Free strategy and soldering
details, please download the ON Semiconductor Soldering and
Mounting Techniques Reference Manual, SOLDERRM/D.
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ESD1014/D
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